COM Express Type VI Basic Size Module based on Intel® Core™ Ultra U/H-series Processors with DDR5 SO-DIMM, DDI, PCIe Gen 4, USB 3.2 Gen 2, 2.5 GbE TSN Ethernet, Discrete TPM 2.0, eDP, SATAIII

COM Express Type 7 Basic Module based on Intel® Xeon® D-1800 Processors

COM Express Type 7 Basic Module based on Intel® Xeo n® D-1700 Processors with Three Channels and Four SODIMM slots

Intel Atom® Processor C3000 Series based COM Express® Type 7 Compact Module

COM-Express® Type 7 Basic module with AMD® Embedded RyzenTM V3000 CPU Family equipped on-module NVME SSD

COM Express Type 6 Basic Size Module

COM Express Type-VI Basic module with Intel® 11th Gen H Processor (Tiger Lake-H) DDR4 SO-DIMM, DDI, PCIe Gen 4.0, USB 3.2 Gen2x1, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP/LVDS, SATA III and VGA

PCOM-B655VGL is Intel® Comet Lake-S platform COM Express module. It is compatible with COMe 3.0 Type 6 carrier board.

Intel® Core™ Coffee Lake-S Processor based on Type VI COM Express module with DDR4 SO-DIMM, DDI, LVDS, Gigabit Ethernet, SATA 3.0 and USB 3.1

Intel® New Generation Networking Processor Based on Type 7 Basic COM Express 3.0 Module with DDR4 ECC/Non-ECC SDRAM on Three SO-DIMM Sockets, up to 20 PCIe Lanes, 10GbE, NC-SI Interface, SATA, and USB

Intel® Core™ Coffee Lake-H Processor based on Type VI COM Express module with DDR4 SO-DIMM, DDI, eDP, Gigabit Ethernet, SATA 3.0 and USB 3.1

AMD R-Series SoC Type VI Com Express Module board

COM Express Type6 Compact size module with Intel® 13th Gen P/U Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB4, USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA

COM Express® Type6 Compact size module with Intel Atom® Amston Lake Series SoC DDR5 SO-DIMM, DDI, PCIe Gen 3, USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA.

COMe 6C-TGL Standard COM Express® Compact type 6, powerful graphics platform

PCOM-B645VGL, a Type 6 compact COM Express® (95 x 95 mm) module which based on Intel® Elkhart Lake Atom® x6000 and Pentium® N and J Series Processors.

11th Generation Intel® Core™ processor (Tiger Lake-UP3) based COM Express® Type VI Compact Module with DDR4 up to 64GB, Four Displays, Gigabit Ethernet, PCIe, SATA 3.0, and USB 3.2 Gen 2

Intel® Core™ Whiskey Lake U Processor based on Type VI COM Express module with DDR4 SO-DIMM, DDI, eDP, Gigabit Ethernet, SATA 3.0 and USB 3.1

Portwell PCOM-B641VG is designed with Intel® Atom™ E3900 Series ultra low power processor with higher memory performance and advance graphic controller for Automation, Healthcare and Thin Client Systems

Intel® Skylake-U Core™ i7/i5/i3 processor based on Type VI Compact-COM Express 2.0 module with DDR4 SDRAM on SO-DIMM slots, VGA, LVDS, Display-port, Gigabit Ethernet, PCIE, SATA, USB, and OTG

Intel Baytrail E38xx-series CPU based Type VI COM Express® module with DDR3L SDRAM, VGA, eDP, HDMI, Gigabit Ethernet and 3Gbps SATA.

Intel® Atom® x7000 series SoC based on Type 10 mini COM-Express® module with LPDDR5 SDRAM

Intel® Atom® x6000 series SoC (Elkhart Lake) based on Type 10 mini COM-Express@ module with LPDDR4 SDRAM

COMe 10M-EHL Standard COM Express® Mini type 10, suitable for IoT and real time performance

PCOM-BA01, Portwell's brand new COM express Mini size low power module, with display up to 4K digital display resolution and wide temperature range targeting for extreme environment.

Type 10 Mini COM Express module based on Intel® Atom™ E3800 seriec SoC with DDR3L SDRAM, NANDrive, DDI support, USB3.0

AMD G‐Series SoC Type 10 Com Express Module board

Mini-ITX size form factor carrier board for COM Express Type6 module

PCOM-C615 is PICMG 1.3 Full Size Form Factor Evaluation Carrier Board for COM Express® Revision 2.0 Type VI Module. PCOM-C615 follows standard PICMG 1.3 golden finger pin definition and let customer save system total cost for easily upgrading modules

Micro-ATX Form Factor Evaluation Carrier Board for COM Express® Rev 2.1 Type VI Module.

ATX Form Factor Evaluation Carrier Board for COM Express Revision 3.0 Type VI Module

Mini-ITX Form Factor Carrier Board For COM Express Type VI Module CPU embedded Module

Nano-ITX Form Factor COM Express Carrier Board for Type VI COM Express Module

COM-HPC Server type Carrier Board (305 x 330 mm)

COM-HPC® Client module Size C module with Intel® 13th/14th Gen socket type processor (Code Name: Raptor Lake-S Refresh) DDR5 SO-DIMM, DDI, PCIe Gen 5, USB 3.2 Gen2, 2.5G Ethernet, discrete TPM 2.0, eDP, SATA

11th Gen Intel® Core™ Processors (Tiger Lake-UP3) based COM-HPC Client Type Size A module

COM-HPC Evaluation Carrier Board for COM-HPC Client Type Module (305 x 244 mm)

12th Gen Intel® Core™ H/P/U-series Processors (Alder Lake-P)/13th Gen Intel® Core™ H/P/U-series Processors (Raptor Lake-P) based COM-HPC Client Type Size B Module

COM-HPC Server Type Size E module with Intel® Xeon® D-2700 series Processor