Materials in the production line are prepared based on the packing list provided by the warehouse staff and are stored in the WIP buffer area.

Material Baking The SMD components tend to be thin, hence, can't endure high temperature.

Solder Paste PrintingA stencil plate is used to print the soldering paste thru the plate holes onto the PCB.

AOI - Soldering PasteOne-hundred percent automatic inspection of the PCB after solder paste printing detects defects and improves quality the first time.

Chips MountingHigh Speed Mounting pertains to different tiny components such as resistors, capacitors and ICs. This is a widely used procedure to achieve high precision production.

Visual InspectionVisual inspection stations are equipped with computers with Standard Operating Procedures (SOP) for each product. The SOPs are composed of diagrams which allow our technicians to run their inspection effortlessly and efficiently.

Reflow SolderingReflow utilization uses an internal heat cycle system which allows the soldered components on the PCB to be soldered after cooling.

AOI - MountingThe AOI machine uses an optical inspection method to verify that the printing, mounting, and reflow processes were completed without defects.

Visual Inspection & RepairOur visual technicians utilize magnifying glass examination to check for material flaws that causes undesirable tendency.

In-Circuit Testing (ICT)The ICT automated test system can check the assembly circuit wafer, short circuits, abruptions, resistors, capacitors, inductor components values, as well as diode, transistor, FET, SCR, TRIAC, IC for anomallies.

IPQCOur IPQC personnel examine all products according to the IPC-610D magnifying glass standards to determine and confirmed ECO, BOM and assure the production contents are without defects.

Makes certain that all the system components were assembled properly (Main board, Cable, Fan, HDD, etc.)

Once systems have been assembled, they will have already been visually inspected. Our inspectors ensure all components and accessories are assembled properly and follow MFG before testing.

Verifies that all the production processes are completed correctly and accordingly to specification.

In order to ensure the system product is able to boot up by Dynamic Burn-In, 100% of the system products are tested for electronic functionality via a Basic Function Testing after assembly.

DBI is the test used before the product is shipped out. The purpose is to screen possible weaknesses and failures which affect its reliability under different environments.

This procedure is to ensure the quality and functionality of the system product after the Burn-in test.

We inspect the product for external defectiveness. Once they have passed, we then collocate all accessories into plastic bags then proceed with boxing and labeling.

Finished and packed goods are placed in this area for inspection; the FQC department will inspect finished goods based on standard procedures.

To implement QC inspection procedure on packaged and finished goods, OQC has the MIL–STD 105E Table. QC staff conducts sampling according to required sampling by quantity.

In order to meet the demands of storage, transportation, loading and unloading the products mechanically, our pallet stretch wrap machine is designed to enhance production efficiency and prevent damage to the products during transportation.